Client Categories - Electronics
IDEAL USAGE OF COPPER MIM FOR THE ELECTRONIC HEAT SINKS
What Customer needs:
Needed an unconventional heat sink for the small form-factor pluggable (SFP) and Quad Small Form-factor Pluggable (QSFP) modules used for both telecommunication and data communication applications. These SFP and QSFP are compact, hot-pluggable transceiver modules used in interfacing network hardware (such as servers and switches) to a fiber optic cable or electrical connection.
AMT has registered CuMIM® for the application of pure copper using the MIM technology. Utilizing the MIM technology capability allows engineers to design unconventional copper heat sink for both passive and active heat sink applications. This innovative application is ideal to produce the heat sink needed for the SFP and QSFP applications which require heat sinks with complex geometry to fit into the compact module housing as well as a good heat dissipating capability. Till date, AMT had delivered more than 5 million copper heat sink globally for use in this application in the industry.
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